1.Yuav ua li cas hom ntawm online puv - cov cuab yeej tshuaj xyuas muaj?
Txias dov nruam cov kab ntau lawm (nruam annealing / leveling / rewinding) feem ntau ua haujlwm ntawm qhov nrawm ntawm 300-1200 m / min, uas tsis tuaj yeem saib xyuas manually hauv lub sijhawm tiag tiag thiab yuav tsum vam khom lub tshuab kuaj xyuas qhov tsis zoo.
Cov Khoom Siv: Ntshuam: Cognex (USA), ISRA (Lub Tebchaws Yelemees), Parsytec (Lub Tebchaws Yelemees) Hauv Tebchaws: Cov neeg tsim khoom koom nrog Beijing University of Science thiab Technology thiab Huazhong University of Science thiab Technology
2.Dab tsi yog qee qhov piv txwv ntawm qhov kaj + qhov tsaus ntuj ua ke?
Ci ntsa iab (ntu illumination): Lub qhov dej tshwm li qhov tsaus ntuj (lub teeb pom kev tawm ntawm lub lens).
Tsaus teb (tsawg- lub kaum sab xis teeb pom kev zoo): ntug ntawm lub qhov dej zoo li lub nplhaib ci (diffuse reflection ntawm ntug).
Cov ntsiab lus: Lub teeb ci ntsa iab ib leeg muaj qhov tsis zoo siab tsis zoo (tshwj xeeb tshaj yog rau ci iab steel strips). Ib qho chaw tsaus nti yog tsim nyog; txwv tsis pub, cov pits yuav luag tsis pom tom qab smoothing.
3.Dab tsi yog ib co algorithmic pitfalls?
Cov txheej txheem tsis pom kev zoo ib yam tuaj yeem tshaj tawm cov khoom emulsion tsis raug, dej cim, thiab plua plav ua qhov pits.
3D laser profile yuav tsum tau qhib:
2D tsuas pom qhov hloov pauv grey;
3D ntsuas qhov tob ntawm cov ntaub ntawv; cov pits tiag tiag qhia qhov tob tsis zoo, thaum plua plav qhia qhov siab zoo.
Kev pom zoo: Yog tias pob nyiaj siv tsawg, tsawg kawg yog siv lub teeb pom kev zoo + ntau-lub kaum sab xis 2D fusion.
4.Yuav ua li cas yog offline sampling soj ntsuam?
Kev kuaj pom pom + kev soj ntsuam tactile (feem ntau yooj yim, tseem siv tau)
Txoj kev: Saib ntawm lub kaum sab xis 45℃tiv thaiv lub teeb, thiab kos nrog koj cov ntiv tes thaum saib.
Kev ntsuam xyuas tactile: Cov npoo ntawm cov pits hnov me ntsis ntxhib; cov cheeb tsam tsa yuav snag ntawm koj cov ntiv tes.
Limitations: Only applicable to depths >5μm, thiab tso siab rau tus neeg siv kev paub dhau los.
Oilstone Polishing (Kev puas tsuaj, tab sis qhov tseeb heev)
Cov cuab yeej: Square oilstone (400-600 grit).
Cov txheej txheem: Siv cov roj av los yog roj teeb thiab txhuam qhov chaw xav tias 10-20 zaug hauv ib qho kev taw qhia.
Kev Txiav Txim Siab:
Tiag tiag Pits: Tom qab polishing tawm ntawm qhov chaw roughness, qhov tsaus me ntsis nyob twj ywm nrog meej ciam teb.
Fake Pits (Dirty / Watermarked): ploj tom qab ob peb polishes.
Zaj duab xis- txheej txheem txheej (kev tshuaj xyuas microscopic) yog siv los tshuaj xyuas kev tsis txaus siab thiab sau cov pov thawj rau kev thov.
Txoj kev: soften cov zaj duab xis nrog cellulose acetate membrane thiab acetone, thov nws nruj nreem rau cov hniav, thiab tev tawm tom qab ziab.
Qhov peb -dimensional morphology tuaj yeem ntsuas nyob rau hauv lub tshuab kuaj kab mob kom paub qhov txawv ntawm qhov dents yog tshwm sim los ntawm cov menyuam nias rau hauv lossis ib qho khoom txawv teb chaws.
5.Yuav ua li cas thiaj nrhiav tau hauv cov xwm txheej tshwj xeeb?
Scenario 1: Tin-plated/Chromium-plated substrate (nyias heev)
Yam ntxwv: Thickness 0.15-0.30mm, pits feem ntau ua rau xuas nrig ntaus.
Txoj kev: Pinhole detector.
Lub hauv paus ntsiab lus: High-voltage hluav taws xob teb ua rau tawg tawm ntawm qhov chaw thinned ntawm lub qhov.
Muaj peev xwm tsuas ntes tau qhov tob tob tob, tsis yog qhov tob tob.
Scenario 2: Automotive Outer Vaj Huam Sib Luag (High Surface Requirements)
Qhov yuav tsum tau muaj: Tsis pub muaj dents loj dua 0.1mm.
Txoj kev: Roj Film Method (Oiled Surface Check).
Siv ib txheej nyias ntawm cov roj los tiv thaiv - xeb thiab nthuav tawm kom muaj zog, oblique lub teeb.
Qhov sib txawv ntawm cov roj tuav ntawm cov dents yuav tsim kev hloov pauv ntawm cov roj sheen.
Scenario 3: Pickled/Cold-Rolled Coil (Unannealed) Qhov saum npoo yog ntxhib, npog los ntawm hlau oxide nplai, ua rau nws nyuaj heev kom pom qhov muag pom.
Txoj kev: Eddy Current Array.
Nws tuaj yeem ntsuas qhov sib txawv ntawm qhov chaw conductivity; eddy tam sim no teeb liab hloov sai sai ntawm pits.
Disadvantage: rhiab heev rau qhov ntiav ntiav yog qis dua qhov kev soj ntsuam pom.