1.Dab tsi yog cov kev cai tseem ceeb rau lub rooj tsav xwm nti?
Kev rwb thaiv tsev hluav taws xob zoo heev: Lub substrate muaj cov kab hluav taws xob zoo heev (linewidth / spacing tuaj yeem qis dua 10 micrometers), yuav tsum tau rwb thaiv tsev ntawm txhua kab. Hlau, ua tus neeg xyuas pib zoo, yog qhov tsis tsim nyog rau qhov kev xav tau rwb thaiv tsev no.
Tswj tau qhov dielectric tas li thiab qhov poob qis: Cov no cuam tshuam rau qhov zoo ntawm -ceev teeb liab kis tau tus mob. Steel cov khoom hluav taws xob tsis zoo kiag li.
Sib piv thermal expansion coefficient nrog nti: Chips yog silicon - cov khoom siv nrog cov coefficient tsawg heev ntawm thermal expansion. Hlau cov coefficient ntawm thermal expansion yog ntau dua li cov khoom siv silicon thiab PCB zoo tib yam, ua rau muaj kev ntxhov siab loj heev thaum lub sij hawm hloov kub, ua rau chip puas los yog solder sib tsoo.
Tsis tshua muaj siab ruaj khov thiab flatness: Nws tsis deform thaum rov ua dua -kub txheej txheem (xws li vuam thiab lamination). Thaum lub caij txias - dov steel yog tiaj tus, nws cov thermal stability ntawm micrometer nplai yog qhov qis dua ntawm cov khoom siv tshwj xeeb substrate.
Haum rau micro- qhov ua thiab electroplating: Laser drilling ntawm me me heev los ntawm - qhov ua raws li tooj liab electroplating yog yuav tsum tau ua kom tiav conductivity ntawm txheej. ruaj khov micro- qhov txheej txheem metallization yog qhov nyuaj rau kev ua tiav ntawm cov hlau.
Lub teeb yuag: Chip substrates prioritize lightness thiab thinness. Cov hlau muaj qhov ntom ntom ntau dua li cov khoom siv feem ntau.
2.Dab tsi yog cov khoom tseem ceeb ntawm ultra-nyias txias- dov coils (xws li "tearable steel")?
Zoo heev metallic zog thiab toughness: tuav zoo mechanical zog txawm nyob rau hauv tsis tshua muaj nyias lub xeev.
High flatness thiab nto tiav.
Zoo hluav taws xob conductivity thiab electromagnetic shielding.
Ib qho℃ntawm corrosion kuj (ua tau los ntawm txheej).
3.Dab tsi yog qhov kev siv siab siab -kawg ntawm ultra-thin txias- dov coils?
Consumer electronics structural Cheebtsam: xws li smartphone thav ntawv, roj teeb backplates, thiab txhawb daim hlau rau foldable screen hinges.
Precision Cheebtsam: xws li shielding npog rau precision instruments nyob rau hauv aerospace, lithography tshuab qhov chaw, thiab siab -precision spring sheets.
Tshiab zog teb: xws li hlau substrates rau saj zawg zog solar cells thiab bipolar daim hlau rau roj hlwb.
4.Vim li cas peb thiaj hais tias "tsis yog"?
Insulation vs. Conductivity: Qhov no yog qhov tseem ceeb tshaj qhov tsis sib xws. Lub substrate ntawm lub chip cab kuj yuav tsum yog ib tug insulator (xws li BT resin, ABF zaj duab xis, ceramics, los yog tshwj xeeb engineering yas), thaum hlau yog ib tug conductor.
Thermal Expansion Matching vs High Thermal Expansion: Steel's CTE yog kwv yees li 11-13 ppm / degree, thaum silicon's yog kwv yees li 2.6 ppm / degree. Qhov tsis sib haum xeeb loj no txhais tau hais tias kev siv ncaj qha rau hauv ntim yuav ua rau thermal tsis ua haujlwm.
Microcircuit Fabrication Compatibility: Chip carrier boards siv lithography, etching, thiab electroplating txheej txheem ua hauj lwm nyob rau hauv lub semiconductor / PCB kev lag luam. Cov txheej txheem no muaj qhov tsis zoo sib xws nrog cov hlau substrates.
5.Dab tsi yog qhov muaj feem cuam tshuam thiab cuam tshuam txog kev siv tshuab?
Cov khoom siv rau kev tsim khoom: Cov no tuaj yeem siv los tsim cov khoom precision hauv cov khoom siv semiconductor lossis cov khoom siv substrate, xws li cov ntaub thaiv npog, cov khoom hauv lub tshuab nqus tsev, thiab caj npab conveyor.
Ntim perimeter thiab tshav kub dissipation: Nyob rau hauv kev ntim siab heev (xws li 2.5D / 3D ntim), hlau thav duab los yog cov ntaub ntawv txhawb zog yuav raug siv los txhim kho tag nrho cov qauv los yog pab kom sov dissipation. Ultra-nyias siab- lub zog hlau tuaj yeem pom cov ntawv thov hauv cov "tsis yog-cov tub ntxhais circuit" cov khoom.
Lead thav duab: Cov pob khoom siv chips (xws li QFN) siv tooj liab-raws li lossis hlau-nickel alloy txhuas thav ntawv. Ultra-thin precision steel strips tuaj yeem sib tw hauv kev lag luam no, tab sis cov teeb meem cuam tshuam nrog electroplating, etching, thiab thermal matching yuav tsum tau hais. Tam sim no, tooj liab thiab Alloy 42 (ib qho hlau-nickel alloy) tseem nyob hauv lub ntsiab.